Products



Die Attach Adhesive

Application: MOSFET、Heat sink、BGA、QFN、PBGA、QFP、LQPD、LPDDP、Ink cartridges
 

High thermal conductive
9889
9888
9888HT

Conductive
9222LT
9246S
9246LB5
9555
9555NS
9699LV
9699LV-C3
9699HT
8143
8511

Non-Conductive
NC7720
NC7720B
NC7720L
NC7720M
NC7730M
NC300
NC1022
NC6911
NC9112

Inkjet
RA8888
IN1689
IN1513

B-Stage
BS1002
 


Die Attach Film
Application: Substrate/Lead frame/Die to die
 


Conductive

CDF4110
CDF4115
CDF4815
CDF4915


Non - Conductive

DF1020
DF1025
DF3020
DF3025
  
 
Release Film
Application: Release film used for packaging.
Package type
Major product model Adhesive Layer Base Film
QFN
QFN
 RF3810
RF5010
RP3810
RPN3825 		10 µm
10 µm
 38 µm
50 µm
 
Dicing Tape
Application: To prevent backside of wafer from cracking and prevent die from flying off.
Type
Liner Film Adhesive Layer Base Film
UV tape
Non-UV tape 		PET 10~30µm PVC & PO Film