Products




Die Attach Adhesive

Application: MOSFET、Heat sink、BGA、QFN、PBGA、QFP、LQPD、LPDDP、Ink cartridges
 

High thermal conductive

9889
9900GC

Conductive

9246S
9699LV
9888
8511
9699NS
9699HT
9888HT
9005SP-2

Non-Conductive

NC7720M
NC7730M
NC7720
NC9112

B-Stage
BS1002

Inkjet
RA8888
IN1689
IN1513
  



Die Attach Film
Application: Substrate/Lead frame/Die to die
 


Conductive

CDF4125


Non - Conductive


DF1020
DF1025
DF3020
DF3025
  
 
Release Film
Application: Transfer-molding
Package type
Major product model Adhesive Layer Base Film
QFN
QFN
 RF3810
RF5010
 10 µm
10 µm
 38 µm
50 µm